IGNISFORMA operates an integrated hardware engineering, FPGA/DSP, firmware, mechanical CAD, and SMT assembly lab in Bengaluru, India. We deliver custom embedded electronics and ODM solutions for global OEMs.
High-speed multi-layer PCB design (impedance controlled, HDI), ultra-low-noise analog frontends for micro-volt strain signals, and isolated power management.
RTL Verilog/VHDL for FPGA signal processing, ARM Cortex-M55 Helium DSP acceleration, TinyML edge model compression, and RTOS/Linux BSP development.
SolidWorks 3D CAD, thermal finite element analysis (FEA), IP67/IP69K sealing tooling, and in-house Bengaluru SMT assembly with automated optical inspection (AOI).
| Model | Deliverables | IP Ownership | Customer Responsibility | Warranty & Support |
|---|---|---|---|---|
| 1. Product Platforms | Off-the-shelf IGFO-100 & Mercury Z1 sensor nodes, standard register maps | IGNISFORMA standard product IP | Mechanical mounting and field wiring | 2-year standard hardware warranty + firmware updates |
| 2. Custom ODM | Custom schematics, customized PCB form factor, tailored firmware BSP & mechanical tooling | Agreed co-development IP or full customer assignment per contract | Application PRD and field testing sign-off | Extended multi-year lifecycle manufacturing guarantee & RMA |
| 3. Turnkey Solutions | Pre-commissioned sensors, edge gateways, SCADA integration, on-site/remote baseline calibration | Standard platform IP with custom solution configuration scripts | Physical asset access and IT network firewall routing | SLA maintenance, periodic sensor recalibration & remote support |
Engage our Bengaluru engineering team to review your technical requirements, bill of materials (BOM) targets, and production schedule.