Silicon-to-Cloud Deterministic Intelligence

The IGNISFORMA Industrial Technology Stack

Engineered from our Bengaluru R&D facility, IGNISFORMA combines low-power Edge AI micro-DSP, deterministic fieldbus protocols, open interoperability standards (OPC UA, Margo), defense-in-depth cybersecurity, and SIL functional safety into unified industrial hardware.

PILLAR 01 LATENCY: 1.8 MS • ON-CHIP INT8

Edge AI & Sensor-Level Micro-DSP

Traditional IoT systems stream massive raw vibration time-series data to the cloud, generating high latency and bandwidth costs. IGNISFORMA executes feature extraction, 2048-point FFT spectral decomposition, envelope demodulation, and TinyML neural autoencoder inference directly on-chip inside the sensor node.

DSP Core Engine
ARM Cortex-M4 / NXP i.MX8M Plus

Hardware FPU & SIMD instructions computing 2048-point real-time FFTs in <1.2ms.

Quantized Neural Inference
INT8 Deep Autoencoder

Sub-surface anomaly scoring without cloud connection. <0.2% precision loss vs FP32.

  • ISO 10816-3 Mechanical Severity: Real-time on-chip evaluation of velocity RMS across Class I–IV industrial assets.
  • Bearing Characteristic Frequencies: Automated extraction of BPFO, BPFI, BSF, and FTF cage frequencies with envelope demodulation.
  • Acoustic Audio Signature Recognition: 20 Hz – 20 kHz wideband audio energy analysis detecting micro-cavitation and gas jetting.
TINYML INFERENCE BENCHMARK • INT8 CMSIS-NN
// Real-Time Anomaly Inference Loop
float loss = Autoencoder_Infer(fft_buffer);
if (loss > DYNAMIC_THRESHOLD) {
  Trigger_Deterministic_Trip();
  Lock_Circular_Flight_Recorder();
  Publish_OPCUA_Alarm(SEVERITY_CRITICAL);
}
INFERENCE LATENCY
1.78 ms
FLASH MEMORY FOOTPRINT
42.4 kB
PILLAR 02

Deterministic Industrial Protocols: EtherNet/IP, EtherCAT & SPE

Plant environments demand zero-jitter determinism and seamless integration with existing Rockwell Automation, Siemens, Beckhoff, and Schneider Electric PLC networks.

ODVA STANDARD CIP SYNC

EtherNet/IP & CIP

Native Common Industrial Protocol (CIP) implementation supporting implicit I/O messaging, explicit parameter configuration, and EDS files for Allen-Bradley ControlLogix & CompactLogix PLCs.

  • Implicit cyclic I/O data rate: up to 1 kHz
  • IEEE 1588 CIP Sync precision timestamping
  • Pre-tested EDS integration files included
ETG CONFORMANCE < 1.0 MS CYCLE

EtherCAT Slave Engine

High-speed EtherCAT slave controller with hardware sync managers and distributed clocks (DC) achieving sub-microsecond synchronization for motion control and fast-trip tripping.

  • Cycle time: down to 250 µs with ±20ns jitter
  • ESI XML device description for TwinCAT 3
  • CoE (CANopen over EtherCAT) parameter dictionary
IEEE 802.3cg 1,000M REACH

Single Pair Ethernet (SPE)

10BASE-T1L Single Pair Ethernet delivering 10 Mbps point-to-point IP connectivity and simultaneous Power over Data Lines (PoDL) over 1,000 meters of single twisted copper.

  • PoDL Class 10/11 up to 13W remote power
  • Full IP addressability down to the physical sensor
  • Replaces legacy 4-20mA and RS-485 serial
PILLAR 03

OPC UA & Margo-Aligned Interoperability

Eliminate vendor lock-in with open, standardized semantic data modeling. IGNISFORMA edge compute gateways embed native OPC UA Servers (IEC 62541) and adhere to the Linux Foundation MARGO open standard for industrial edge container orchestration and interoperability.

01

Semantic Machine Data Models

Rich companion specifications structuring vibration spectra, acoustic energy, thermal gradients, and health status into unified tree hierarchies.

02

OPC UA Alarm & Conditions (A&C)

Deterministic alarm state machines dispatched directly to SCADA operator consoles (Ignition, Wonderware, WinCC) without external polling software.

03

Margo Edge Application Standard

Containerized edge microservices packaged and deployed through standard OCI containers, enabling seamless orchestration via Kubernetes or local edge managers.

OPC UA ASSET NODE STRUCTURE IEC 62541
┌─ RootFolder
┌─ Objects
┌─ IGNISFORMA_IGFO100_A4
├─ Vibration_RMS_Velocity [mm/s] = 1.42
├─ Acoustic_Audio_Energy [dBA] = 18.4
├─ ISO10816_Zone = "Zone A (Normal)"
├─ TinyML_Anomaly_Score = 0.02
└─ TripRelay_State = "ENERGIZED_CLOSED"
Compatibility Verified: Siemens WinCC • Inductive Automation Ignition • Rockwell FactoryTalk • AVEVA PI System
PILLAR 04

Industrial Cybersecurity: IEC 62443 Defense-in-Depth

Physical operational assets require zero-trust hardware protection. Every IGNISFORMA device incorporates a dedicated secure element, cryptographic root of trust, and encrypted dual-bank firmware verification compliant with IEC 62443-4-2.

Hardware Root of Trust

Dedicated tamper-resistant crypto coprocessor (NXP EdgeLock / Microchip ATECC608B) securing unique device keys, ECDSA certificates, and NIST-compliant entropy generation.

Secure Boot & Dual OTA

Cryptographically signed bootloaders verify RSA-3072 / ECDSA P-256 signatures before booting. A/B dual-bank flash enables zero-downtime atomic updates with automated fallback rollback.

TLS 1.3 & OPC UA Security

Mutual certificate-based authentication (mTLS) across all SPE, Ethernet, and Wi-Fi links. AES-256-GCM encryption on all telemetry and configuration data streams.

PILLAR 05

High-End Hardware Design: FPGA, SoC & MCU Signal Processing

From high-density multi-layer HDI printed circuit boards to sub-microvolt analog front-ends, IGNISFORMA delivers premier high-end hardware design. We integrate heterogeneous architectures combining high-performance FPGAs (AMD, Intel, Lattice), multi-core application SoCs, and real-time deterministic MCUs (ARM Cortex-M33 / M7, RISC-V) with unified embedded firmware.

Our full-stack firmware (FW) and board support package (BSP) engineering teams develop deterministic FreeRTOS / Zephyr kernels, bare-metal high-speed ISR handlers, and optimized SoC Linux drivers for mission-critical sensing and industrial robotics.

  • High-End Hardware Design: 8-to-12 layer impedance-matched HDI PCBs, controlled differential routing, sub-45 µg/√Hz analog noise floors, and ruggedized thermal dissipation.
  • MCU & SoC Application FW: Low-power MCU firmware, multi-threaded SoC RTOS, DMA-driven peripheral engines, and fault-tolerant bootloaders.
  • FPGA Hardware Parallelism: Verilog/VHDL RTL IP pipelines executing sub-500ns hardware cutoffs, polyphase FIR filters, and multi-channel synchronous decimation.
HARDWARE, SOC & RTL SPECS FPGA • SOC • MCU
Compute Silicon Platforms
AMD / Lattice FPGA + ARM Cortex-M7/M33 MCU + NXP SoC
Hardware Layout Architecture
High-Density HDI, Controlled Impedance, < 45 µg/√Hz AFE
Embedded Firmware Architecture
Deterministic RTOS, Bare-Metal Low-Latency ISR, TinyML INT8
Hardware Cutoff Latency
< 450 Nanoseconds (Zero CPU Overhead)
PILLAR 06

Functional Safety: SIL-2 / Cat 4 PL e Fast-Trips

Protecting expensive turbomachinery, chemical reaction vessels, and high-speed spindles requires independent, fail-safe hardware interlocking that does not rely on software loops or cloud connectivity.

SAFETY SPEED < 8.0 MS

Deterministic Solid-State Fast-Trips

Hardware optocoupled solid-state relays de-energize safety circuits within <8ms of threshold or catastrophic vibration spike detection.

IEC 61508 / 62061 SIL-2 READY

Dual-Channel Redundancy (1oo2 / 2oo3)

Redundant sensor elements and cross-monitoring microcontrollers eliminate single-point failures and prevent nuisance false trips.

NVRAM RECORDING 500 MS PRE-EVENT

Circular Flight Recorder

Preserves 500ms pre-event and 500ms post-event uncompressed raw waveform data to non-volatile ferroelectric RAM (FRAM) for post-incident root-cause investigation.

Bengaluru R&D Facility • Turnkey ODM

Engineering & Custom ODM

From custom electronics architecture and FPGA signal processing to small-volume SMT manufacturing, we engineer production-ready embedded solutions tailored to your machinery.

STAGE 01 • 02

Hardware & FPGA Design

High-density multi-layer schematic design, signal integrity analysis, and custom RTL pipelines for real-time edge intelligence.

STAGE 03 • 04

Firmware & Mechanical CAD

Deterministic RTOS/BSP development, on-sensor TinyML inference, and IP67/IP69K ruggedized enclosure engineering.

STAGE 05 • 06

Compliance & SMT Batch MFG

Pre-compliance EMC/climatic screening and pilot-to-batch SMT assembly with 3D AOI inspection at our Bengaluru facility.

View 6-Stage ODM Roadmap →
Custom Technology Co-Development

Need Custom Silicon, RTL or Protocol Engineering?

Collaborate directly with our Bengaluru hardware, FPGA, and firmware engineering teams. From proof-of-concept silicon validation to full SMT batch manufacturing.

Explore ODM Roadmap